- Series:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Output Type:
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- Logic Type:
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- Electus conditionibus;
Odonata Lepidoptera products 642
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Output Type | Number of Elements | Logic Type | Number of Bits per Element | Current - Output High, Low | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Output Type | Number of Elements | Logic Type | Number of Bits per Element | Current - Output High, Low | ||
ON Semiconductor |
3,028
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFF NONINVERT 5.5V 8MICROPAK
|
Cut Tape (CT) | 7NZ | 1.65 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-UFQFN | 8-MicroPak? | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
ON Semiconductor |
3,028
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFF NONINVERT 5.5V 8MICROPAK
|
- | 7NZ | 1.65 V ~ 5.5 V | -40°C ~ 85°C (TA) | 8-UFQFN | 8-MicroPak? | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 8XSON
|
Tape & Reel (TR) | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 8-XFDFN | 8-XSON (1.35x1) | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
4,395
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 8XSON
|
Cut Tape (CT) | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 8-XFDFN | 8-XSON (1.35x1) | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
4,395
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 8XSON
|
- | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 8-XFDFN | 8-XSON (1.35x1) | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 6XSON
|
Tape & Reel (TR) | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 6-XFDFN | 6-XSON (1x1) | Surface Mount | Push-Pull | 1 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
2,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 6XSON
|
Cut Tape (CT) | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 6-XFDFN | 6-XSON (1x1) | Surface Mount | Push-Pull | 1 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
2,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 6XSON
|
- | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 6-XFDFN | 6-XSON (1x1) | Surface Mount | Push-Pull | 1 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 8XSON
|
Tape & Reel (TR) | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 8-XFDFN | 8-XSON (1.35x1) | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
4,939
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 8XSON
|
Cut Tape (CT) | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 8-XFDFN | 8-XSON (1.35x1) | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
Nexperia USA Inc. |
4,939
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V 8XSON
|
- | 74LVC | 1.65 V ~ 5.5 V | -40°C ~ 125°C (TA) | 8-XFDFN | 8-XSON (1.35x1) | Surface Mount | Push-Pull | 3 | Buffer,Non-Inverting | 1 | 32mA,32mA | ||||
ON Semiconductor |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BUFF NONINVERT 3.6V 6MICROPAK
|
Tape & Reel (TR) | 7SP | 0.9 V ~ 3.6 V | -40°C ~ 85°C (TA) | 6-UFDFN | 6-MicroPak2? | Surface Mount | Push-Pull | 1 | Buffer,Non-Inverting | 1 | 2.6mA,2.6mA | ||||
ON Semiconductor |
3,991
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFF NONINVERT 3.6V 6MICROPAK
|
Cut Tape (CT) | 7SP | 0.9 V ~ 3.6 V | -40°C ~ 85°C (TA) | 6-UFDFN | 6-MicroPak2? | Surface Mount | Push-Pull | 1 | Buffer,Non-Inverting | 1 | 2.6mA,2.6mA | ||||
ON Semiconductor |
3,991
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFF NONINVERT 3.6V 6MICROPAK
|
- | 7SP | 0.9 V ~ 3.6 V | -40°C ~ 85°C (TA) | 6-UFDFN | 6-MicroPak2? | Surface Mount | Push-Pull | 1 | Buffer,Non-Inverting | 1 | 2.6mA,2.6mA | ||||
Texas Instruments |
Quaestiones
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC BUFFER NON-INVERT 3.6V 6SON
|
Tape & Reel (TR) | 74AUP | 0.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | 6-XFDFN | 6-SON (1x1) | Surface Mount | Push-Pull | 2 | Buffer,Non-Inverting | 1 | 4mA,4mA | ||||
Texas Instruments |
3,282
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 3.6V 6SON
|
Cut Tape (CT) | 74AUP | 0.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | 6-XFDFN | 6-SON (1x1) | Surface Mount | Push-Pull | 2 | Buffer,Non-Inverting | 1 | 4mA,4mA | ||||
Texas Instruments |
3,282
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 3.6V 6SON
|
- | 74AUP | 0.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | 6-XFDFN | 6-SON (1x1) | Surface Mount | Push-Pull | 2 | Buffer,Non-Inverting | 1 | 4mA,4mA | ||||
Nexperia USA Inc. |
Quaestiones
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V
|
Tape & Reel (TR) | 74AHCV | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | 20-VFQFN Exposed Pad | 20-DHVQFN-EP (2.5x4.5) | Surface Mount | 3-State | 1 | Buffer,Non-Inverting | 8 | 16mA,16mA | ||||
Nexperia USA Inc. |
2,730
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V
|
Cut Tape (CT) | 74AHCV | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | 20-VFQFN Exposed Pad | 20-DHVQFN-EP (2.5x4.5) | Surface Mount | 3-State | 1 | Buffer,Non-Inverting | 8 | 16mA,16mA | ||||
Nexperia USA Inc. |
2,730
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
IC BUFFER NON-INVERT 5.5V
|
- | 74AHCV | 1.8 V ~ 5.5 V | -40°C ~ 125°C (TA) | 20-VFQFN Exposed Pad | 20-DHVQFN-EP (2.5x4.5) | Surface Mount | 3-State | 1 | Buffer,Non-Inverting | 8 | 16mA,16mA |