- Operating Temperature：
-
- Height：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Electus conditionibus;
Odonata Lepidoptera products 260
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | |
|
|
|
Laird Technologies EMI |
114
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.40MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | - | - | ||
|
|
|
Laird Technologies EMI |
219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.320" (8.13mm) | - | - | ||
|
|
|
Laird Technologies EMI |
527
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 11.43X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.450" (11.43mm) | - | - | ||
|
|
|
Laird Technologies EMI |
491
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | - | - | ||
|
|
|
Laird Technologies EMI |
102
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | - | - | ||
|
|
|
Laird Technologies EMI |
499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.40MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | - | - | ||
|
|
|
Laird Technologies EMI |
85
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.4MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | - | - | ||
|
|
|
Laird Technologies EMI |
35
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 13X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.510" (12.95mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.4MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.370" (9.40mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 6.6X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.260" (6.60mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 0.280" (7.11mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X406.4MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 0.320" (8.13mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Unplated | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | ||
|
|
Leader Tech Inc. |
453
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.320" (8.13mm) | - | - | |||
|
|
Leader Tech Inc. |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 0.550" (13.97mm) | Tin | - |
