- Series:
-
- Operating Temperature:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 26
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
162
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
63
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USFT
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIE,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNY,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT USFT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL NIE PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | Nickel | 299.21μin (7.60μm) | Adhesive |