- Series：
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- Operating Temperature：
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- Material：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 37
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.137" (3.48mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
19,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.093" (2.37mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
30,219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.093" (2.37mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
30,219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.093" (2.37mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
1,126
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 2.3X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.091" (2.30mm) | - | - | Adhesive | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
TE Connectivity AMP Connectors |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1312ATYPE
|
- | - | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.047" (1.20mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
15,748
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1312ATYPE
|
- | - | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.047" (1.20mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
15,748
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1312ATYPE
|
- | - | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.047" (1.20mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
78,805
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER，LOOSE PIECE，TYPE
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.154" (3.90mm) | 0.094" (2.40mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.30MM HEIGHT UNIVERSAL CONTACT
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.137" (3.48mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.30MM HEIGHT UNIVERSAL CONTACT
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.137" (3.48mm) | 0.043" (1.10mm) | Gold | Flash | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 1.3H TI CU G/F P
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.137" (3.48mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
- | - | Fabric Over Foam | - | D-Shape | 4.000" (101.60mm) | 0.252" (6.40mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 6.190" (157.23mm) | 0.091" (2.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
- | - | Fabric Over Foam | - | D-Shape | 4.500" (114.30mm) | 0.252" (6.40mm) | - | - | - |
