- Operating Temperature：
-
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
-
- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 52
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.098" (2.50mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.132" (3.35mm) | 0.035" (0.90mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
147
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 14.33X457.2MM BELL
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Bell | 18.000" (457.20mm) | 0.563" (14.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
47
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 4.6X457.2MM BELL
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Bell | 18.000" (457.20mm) | 0.181" (4.60mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
5
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.177" (4.50mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 14.33X457.2MM BELL
|
- | - | Fabric Over Foam | - | Bell | 18.000" (457.20mm) | 0.563" (14.30mm) | - | - | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PRE-LOADED SPRING FINGER 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.128" (3.26mm) | 0.045" (1.15mm) | Gold | 19.69μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
11,475
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PRE-LOADED SPRING FINGER 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.128" (3.26mm) | 0.045" (1.15mm) | Gold | 19.69μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
11,475
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PRE-LOADED SPRING FINGER 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.128" (3.26mm) | 0.045" (1.15mm) | Gold | 19.69μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.130" (3.31mm) | 0.037" (0.95mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
10,525
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.130" (3.31mm) | 0.037" (0.95mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
10,525
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.130" (3.31mm) | 0.037" (0.95mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD SPRING FINGER 1.8MM LEFT
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.115" (2.91mm) | 0.039" (1.00mm) | Gold | Flash | Solder | |||
|
|
TE Connectivity AMP Connectors |
12,441
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD SPRING FINGER 1.8MM LEFT
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.115" (2.91mm) | 0.039" (1.00mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
12,441
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD SPRING FINGER 1.8MM LEFT
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.115" (2.91mm) | 0.039" (1.00mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD SPRING FINGER 1.8MM RIGHT
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.115" (2.91mm) | 0.039" (1.00mm) | Gold | Flash | Solder |
