- Material：
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- Shape：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 16
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
1,322
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 5.1X457.2MM DSHAPE
|
Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 5.1X457.2MM DSHAPE
|
Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
45,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
48,861
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
48,861
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
2.4H SPRING FINGER W/EMBOSS
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.039" (1.00mm) | 0.039" (0.98mm) | Gold | Flash | Solder | |||
|
|
TE Connectivity AMP Connectors |
5,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
2.4H SPRING FINGER W/EMBOSS
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.039" (1.00mm) | 0.039" (0.98mm) | Gold | Flash | Solder | |||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 DSH
|
Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 17.100" (434.34mm) | 0.201" (5.10mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
Fabric Over Foam | - | D-Shape | 72.000" (182.88cm) | 0.201" (5.10mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 DSH
|
Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 96.000" (243.84cm) | 0.201" (5.10mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 DSH
|
Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 96.000" (243.84cm) | 0.201" (5.10mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 DSH
|
Fabric Over Foam | - | D-Shape | 96.000" (243.84cm) | 0.201" (5.10mm) | - | - | - | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HIGH CURRENT SPRING FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.067" (1.70mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
33,281
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGH CURRENT SPRING FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.157" (4.00mm) | 0.067" (1.70mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
2.4H SPRING FINGER WITH EMBOSS
|
Shield Finger，Pre-Loaded | Copper Alloy | - | 0.114" (2.90mm) | 0.039" (1.00mm) | Gold | 15.748μin (0.40μm) | Solder |
