- Series：
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- Operating Temperature：
-
- Length：
-
- Width：
-
- Plating：
-
- Plating - Thickness：
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- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 18
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
78,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
- | -25°C ~ 150°C | Shield Clip | Stainless Steel | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
81,078
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
- | -25°C ~ 150°C | Shield Clip | Stainless Steel | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
81,078
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
- | -25°C ~ 150°C | Shield Clip | Stainless Steel | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Molex，LLC |
64,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
6,551
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Molex Connector Corporation |
6,551
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.30MM - 0.55MM H
|
105384 | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.7μin (0.50μm) | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | Fingerstock | Beryllium Copper | 12.000" (304.80mm) | 0.183" (4.65mm) | Unplated | - | Clip | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.4H SPRING FINGER W/EMBOSS
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.118" (3.00mm) | 0.039" (1.00mm) | Gold | Flash | Solder | |||
|
|
TE Connectivity AMP Connectors |
9,530
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
1.4H SPRING FINGER W/EMBOSS
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.118" (3.00mm) | 0.039" (1.00mm) | Gold | Flash | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1410
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1410
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER1410
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.4H SPRING FINGER WITH EMBOSS
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.114" (2.90mm) | 0.039" (1.00mm) | Gold | 15.748μin (0.40μm) | Solder |
