- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 163
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
2,497
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
656
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 2MMX1M DSHAPE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.079" (2.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Molex，LLC |
45,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.42MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.090" (2.28mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,188
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.42MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.090" (2.28mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,188
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.42MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.090" (2.28mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,207
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,207
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
474
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,185
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.280" (7.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 12.7X457.2MM REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
372
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 19.1X457.2MM REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.752" (19.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
709
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 41X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 1.614" (41.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
124
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 6.4X457.2MM DSHAPE
|
- | - | Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.252" (6.40mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.984" (25.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
6,720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder |
