- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Length：
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- Width：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 18
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
4,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.244" (6.20mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
336
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.236" (6.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
103
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
1,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
14
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 7MMX1M SQ
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Square | 39.370" (1.00m) | 0.276" (7.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
7
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 10MMX1M DSHAPE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.394" (10.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.512" (13.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.669" (17.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 REC
|
- | - | Fabric Over Foam | - | D-Shape | 7.870" (199.90mm) | 0.433" (11.00mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK,NICU,PTAFG,PU,V0,REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK,NICU,NRSG,PU,V0,REC
|
- | - | Fabric Over Foam | - | Rectangle | 18.000" (457.20mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 REC
|
- | - | Fabric Over Foam | - | D-Shape | 17.590" (446.79mm) | 0.433" (11.00mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 REC
|
- | - | Fabric Over Foam | - | D-Shape | 26.380" (670.05mm) | 0.433" (11.00mm) | - | - | - | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | - | Shield Finger | Copper Alloy | - | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder |
