- Series：
-
- Operating Temperature：
-
- Plating：
-
- Plating - Thickness：
-
- Attachment Method：
-
Odonata Lepidoptera products 36
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
244
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.60MM
|
- | 121°C | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
106
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.3X609.6MM
|
Foldover | 121°C | 0.760" (19.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
71
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
7
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.6X609.6MM
|
- | 121°C | 0.260" (6.60mm) | - | - | Snap-In | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | 0.600" (15.24mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | 0.600" (15.24mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | 0.760" (19.30mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | 0.760" (19.30mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | 0.760" (19.30mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FLX,STR,SNB
|
- | 121°C | 0.260" (6.60mm) | Tin | 299.21μin (7.60μm) | Snap-In | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
|
- | 121°C | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDC,PSA
|
- | 121°C | 0.600" (15.24mm) | Cadmium + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
|
- | 121°C | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | 0.600" (15.24mm) | Tin | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,COIL,BF,USFT,PSA
|
- | 121°C | 0.600" (15.24mm) | - | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL SNB PSA
|
All-Purpose | 121°C | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
|
All-Purpose | 121°C | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | 121°C | 0.760" (19.30mm) | - | 299.21μin (7.60μm) | Adhesive |
