Odonata Lepidoptera products 37
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
5411-0005-60-300
Leader Tech Inc.
2
III dies
-
MOQ: 1  MPQ: 1
NI/C FILLED SILICONE; 0.375" OD,
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.375" (9.53mm) - - -
5409-0009-60-300
Leader Tech Inc.
2
III dies
-
MOQ: 1  MPQ: 1
NI/C FILLED SILICONE,0.5" X 0.1
- -55°C ~ 160°C Shielding Material Conductive Elastomer Rectangle - 0.500" (12.70mm) - - -
5411-0003-20-300
Leader Tech Inc.
6
III dies
-
MOQ: 1  MPQ: 1
M83528/011B003,AG/AL FILLED SIL
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.250" (6.35mm) - - -
5411-0003-40-300
Leader Tech Inc.
2
III dies
-
MOQ: 1  MPQ: 1
M83528/011D003,AG/AL FILLED FLO
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.250" (6.35mm) - - -
5411-0005-20-300
Leader Tech Inc.
2
III dies
-
MOQ: 1  MPQ: 1
M83528/011B005,AG/AL FILLED SIL
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.375" (9.53mm) - - -
5411-0005-40-300
Leader Tech Inc.
2
III dies
-
MOQ: 1  MPQ: 1
M83528/011D005,AG/AL FILLED FLO
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.375" (9.53mm) - - -
5401-0001-20-300
Leader Tech Inc.
1
III dies
-
MOQ: 1  MPQ: 1
M83528/001B001,AG/AL FILLED SIL
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.040" (1.02mm) - - -
5409-0006-60-300
Leader Tech Inc.
1
III dies
-
MOQ: 1  MPQ: 1
NI/C FILLED SILICONE; 0.25" X .0
- -55°C ~ 160°C Shielding Material Conductive Elastomer Rectangle - 0.250" (6.35mm) - - -
5401-0006-40-300
Leader Tech Inc.
1
III dies
-
MOQ: 1  MPQ: 1
M83528/001D006,AG/AL FILLED FLO
- -55°C ~ 160°C Shielding Material Conductive Elastomer Round - 0.093" (2.36mm) - - -
0C97086600
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
PCBS COIL BF
- - - - - - 0.827" (21.00mm) - - -
0C97054217
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
NOSG COIL SNB PSA
Foldover 121°C Fingerstock Beryllium Copper - 0.080" (2.03mm) 0.250" (6.35mm) Tin 299.21μin (7.60μm) Adhesive
0C97044017
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
CSTR COIL SNB
Large Enclosure 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.630" (41.40mm) Tin 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97086000
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
PCBS COIL BF
- - - - - - 0.520" (13.20mm) - - -
0C97086608
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
PCBS COIL SNSAT
- - - - - - 0.827" (21.00mm) - - -
0C97044018
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
CSTR COIL NIE
Large Enclosure 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.630" (41.40mm) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
0C98044002
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
CSTR COIL BF USF
Large Enclosure 121°C Fingerstock Beryllium Copper - 0.410" (10.41mm) 1.630" (41.40mm) Unplated - Adhesive
0C97043816
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
CSTR COIL ZNY
Large Enclosure 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 1.090" (27.69mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Hardware,Rivet,Solder