- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Plating：
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- Electus conditionibus;
Odonata Lepidoptera products 15
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
Molex，LLC |
42,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.077" (1.95mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | ||
|
|
|
Molex，LLC |
47,725
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.077" (1.95mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | ||
|
|
|
Molex，LLC |
47,725
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.077" (1.95mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | ||
|
|
|
Harwin Inc. |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.039" (1.00mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.039" (1.00mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.039" (1.00mm) | Gold | Flash | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.157" (4.00mm) | 0.157" (4.00mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.157" (4.00mm) | 0.157" (4.00mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.157" (4.00mm) | 0.157" (4.00mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - |
