- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 83
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
2,468
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.079" (2.00mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Harwin Inc. |
9,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.197" (5.00mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,859
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.197" (5.00mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
10,859
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.197" (5.00mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.157" (4.00mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
1,111
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3X457.2MM SQ
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.118" (3.00mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
628
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3MMX1M RECT
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.039" (1.00mm) | 39.370" (1.00m) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
4,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
5,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
5,230
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
176
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3X457.2MM SQ
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 0.118" (3.00mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
274
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
- | - | Fabric Over Foam | - | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
115
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 3MMX1M RECT
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 0.079" (2.00mm) | 39.370" (1.00m) | - | - | Non-Conductive Adhesive | ||
|
|
|
Leader Tech Inc. |
2,100
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.098" (2.50mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
4,150
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.098" (2.50mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
4,150
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.098" (2.50mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
758
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.394" (10.00mm) | 0.236" (6.00mm) | Gold | Flash | Solder |
