- Series：
-
- Operating Temperature：
-
- Material：
-
- Shape：
-
- Height：
-
- Length：
-
- Plating：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 65
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
4,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.512" (13.00mm) | 0.276" (7.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.512" (13.00mm) | 0.276" (7.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.512" (13.00mm) | 0.276" (7.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
849
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 2.5X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.059" (1.50mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||
|
|
TE Connectivity AMP Connectors |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3025-Z1-T
|
- | - | Shield Finger | Titanium Copper | - | 0.118" (3.00mm) | 0.177" (4.50mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
33,438
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3025-Z1-T
|
- | - | Shield Finger | Titanium Copper | - | 0.118" (3.00mm) | 0.177" (4.50mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,581
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | 1.967μin (0.05μm) | Solder |
