- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 45
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
7,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.098" (2.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.098" (2.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.098" (2.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.138" (3.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,411
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.138" (3.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,411
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.138" (3.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
9,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.157" (4.00mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
9,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.157" (4.00mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
9,266
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.157" (4.00mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
3,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.177" (4.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,480
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.177" (4.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,480
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.177" (4.50mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
1,126
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 2.3X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.051" (1.30mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
171
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 2.3X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.091" (2.30mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
73
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 2.3X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.091" (2.30mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
769
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 2.3X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.126" (3.20mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
86
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 0.091" (2.30mm) | 39.370" (1.00m) | - | - | Non-Conductive Adhesive | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.118" (3.00mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.118" (3.00mm) | 0.181" (4.60mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.118" (3.00mm) | 0.181" (4.60mm) | Gold | Flash | Solder |
