- Series：
-
- Operating Temperature：
-
- Shape：
-
- Height：
-
- Plating：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 22
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Attachment Method | |
|
|
|
Laird Technologies EMI |
192
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.170" (4.32mm) | 16.000" (406.40mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
36
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
22
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTOCK BECU ALY 7.57X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK BECU ALY 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | Unplated | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | Unplated | Adhesive | ||
|
|
Leader Tech Inc. |
243
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | - | - | |||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,BF,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USF
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | - | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,BF,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | - | Adhesive | ||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 0.045 BD 16--10-30
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 050 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 065 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 070 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 045 DL BD 16--10-3
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 050 DL BD 16--10-3
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 065 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 070 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.04 X 0.34 BD 16--4-34D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.040" (1.02mm) | 16.000" (406.40mm) | Unplated | Adhesive |
