- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 57
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Wurth Electronics Inc. |
656
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FABRIC/FOAM 2MMX1M DSHAPE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 0.059" (1.50mm) | 39.370" (1.00m) | - | - | Non-Conductive Adhesive | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.224" (5.70mm) | 0.185" (4.70mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.224" (5.70mm) | 0.185" (4.70mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.224" (5.70mm) | 0.185" (4.70mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.209" (5.30mm) | 0.157" (4.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.209" (5.30mm) | 0.157" (4.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.209" (5.30mm) | 0.157" (4.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
123
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | - | 39.370" (1.00m) | - | - | - | ||
|
|
|
Molex，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.043" (1.10mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder |
