- Operating Temperature:
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- Material:
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- Shape:
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- Height:
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- Length:
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- Plating:
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- Plating - Thickness:
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- Attachment Method:
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- Electus conditionibus;
Odonata Lepidoptera products 57
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | ||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Tin | Flash | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Tin | Flash | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | - | Shield Finger | - | - | 0.098" (2.50mm) | 0.138" (3.50mm) | Tin | Flash | Solder | ||||
TE Connectivity AMP Connectors |
60,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER0820TYPE
|
- | - | Shield Finger | Copper Alloy | - | 0.031" (0.80mm) | 0.134" (3.40mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
61,983
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER0820TYPE
|
- | - | Shield Finger | Copper Alloy | - | 0.031" (0.80mm) | 0.134" (3.40mm) | Gold | 1.967μin (0.05μm) | Solder | ||||
TE Connectivity AMP Connectors |
61,983
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER0820TYPE
|
- | - | Shield Finger | Copper Alloy | - | 0.031" (0.80mm) | 0.134" (3.40mm) | Gold | 1.967μin (0.05μm) | Solder | ||||
TE Connectivity AMP Connectors |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 0820 N-B WITH SE
|
- | - | Shield Finger | Copper Alloy | - | 0.031" (0.80mm) | 0.134" (3.40mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
14,675
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 0820 N-B WITH SE
|
- | - | Shield Finger | Copper Alloy | - | 0.031" (0.80mm) | 0.134" (3.40mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
25,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 1520 AU PL VERSION
|
- | - | Shield Finger | Copper Alloy | - | 0.059" (1.50mm) | 0.134" (3.40mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
28,569
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 1520 AU PL VERSION
|
- | - | Shield Finger,Pre-Loaded | Copper Alloy | - | 0.059" (1.50mm) | 0.134" (3.40mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER,LOOSE PIECE,TYPE
|
- | - | Shield Finger,Pre-Loaded | Copper Alloy | - | 0.039" (1.00mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER,LOOSE PIECE,TYPE
|
- | - | Shield Finger,Pre-Loaded | Copper Alloy | - | 0.039" (1.00mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 19914 EMBOSS ASSEM
|
- | - | Shield Finger,Pre-Loaded | Copper Alloy | - | 0.078" (1.99mm) | 0.204" (5.17mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
15,871
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 19914 EMBOSS ASSEM
|
- | - | Shield Finger,Pre-Loaded | Copper Alloy | - | 0.078" (1.99mm) | 0.204" (5.17mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 2.03X9.9MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.079" (2.00mm) | 0.390" (9.91mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKT FAB/FOAM 2.03X54.1MM DSHP
|
- | - | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Polyester (NI/CU) | D-Shape | 0.079" (2.00mm) | 2.130" (54.10mm) | - | - | Adhesive |