- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 48
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
491
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
483
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.35X406.4MM
|
- | - | - | - | - | - | 16.000" (406.40mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
68
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FSG，.187"H X .25"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 0.187" (4.75mm) | 48.000" (121.90cm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
25
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MF LOAD SERIES 1/4X12
|
ECCOSORB | - | Absorbing Sheet | - | Round | - | 12.000" (304.80mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
15
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI SHIELDING MATERIAL
|
- | - | - | - | Rectangular | - | 16" (406.40mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 6.35X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
MF LOAD SERIES 1/4X12
|
ECCOSORB | - | Fabric Over Foam | - | Round | - | 12.008" (305.00mm) | - | - | - | ||
|
|
Leader Tech Inc. |
93
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | - | |||
|
|
Leader Tech Inc. |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
NI/C FILLED SILICONE; 0.25" OD,
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | - | - | - | |||
|
|
Leader Tech Inc. |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
M83528/009B006，AG/AL FILLED SIL
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Rectangle | - | 25.000 (7.62m) | - | - | - | |||
|
|
Leader Tech Inc. |
5
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
M83528/009D006，AG/AL FILLED FLO
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Rectangle | - | 25.000 (7.62m) | - | - | - | |||
|
|
Leader Tech Inc. |
6
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
M83528/011B003，AG/AL FILLED SIL
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | - | - | - | |||
|
|
Leader Tech Inc. |
2
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
M83528/011D003，AG/AL FILLED FLO
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Round | - | 25.000 (7.62m) | - | - | - | |||
|
|
Leader Tech Inc. |
1
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
NI/C FILLED SILICONE; 0.25" X .0
|
- | -55°C ~ 160°C | Shielding Material | Conductive Elastomer | Rectangle | - | 25.000 (7.62m) | - | - | - | |||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 25.000 (7.62m) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
