Odonata Lepidoptera products 72
Image part manufacturer quantitas partus tempus Unit Price buy Description Operating Temperature Type Material Height Length Width Plating Plating - Thickness Attachment Method
97055577
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
TWT,STR,SNB,PSA
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
97055507
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
TWT,STR,SNPB,PSA
121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Lead,Tin 299.21μin (7.60μm) Adhesive
0C98055017
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
TWT COIL SNB USF PSA
121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Tin 299.21μin (7.60μm) Adhesive
0C98055015
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
TWT COIL ZNC USFT PSA
121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Zinc + Clear Chromate 299.21μin (7.60μm) Adhesive
0C97055008
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
TWT COIL SNSAT PSA
121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Tin 299.21μin (7.60μm) Adhesive
0C97055017
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
TWT COIL SNB PSA
121°C Fingerstock Beryllium Copper 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Tin 299.21μin (7.60μm) Adhesive
0C97055508
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
TWT COIL SNSAT PSA
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
0C97055517
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
TWT COIL SNB PSA
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
0C98055508
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
TWT COIL SNSAT USFT PSA
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
0C98055517
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
TWT COIL SNB USF PSA
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Tin 299.21μin (7.60μm) Adhesive
0C97055518
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
TWT COIL NIE PSA
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Nickel 299.21μin (7.60μm) Adhesive
98055502
Laird Technologies EMI
Quaestiones
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MOQ: 1  MPQ: 1
FINGERSTCK ULTRASFT 8.64X609.6MM
121°C Fingerstock Beryllium Copper 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) - - -