- Operating Temperature：
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- Material：
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- Shape：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 116
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
7,010
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,969
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 4X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,162
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
839
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 7X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.276" (7.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,666
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 5.1X457.2MM RECT
|
- | Fabric Over Foam | - | Rectangle | 18.000" (457.20mm) | 0.201" (5.10mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
671
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 10X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.394" (10.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
642
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 13X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.512" (13.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
274
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
- | Fabric Over Foam | - | Rectangle | 18.000" (457.20mm) | 0.118" (3.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
591
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 4X457.2MM RECT
|
- | Fabric Over Foam | - | Rectangle | 18.000" (457.20mm) | 0.157" (4.00mm) | - | - | Adhesive | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
758
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKT FABRIC/FOAM 3X457.2MM RECT
|
- | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.118" (3.00mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 3.8X457.2MM DSHAPE
|
- | Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.150" (3.80mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RECTANGLE
|
- | Fabric Over Foam | - | Rectangle | 18.000" (457.20mm) | 0.276" (7.00mm) | - | - | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER，LOOSE PIECE，TYPE
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.154" (3.90mm) | 0.094" (2.40mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
94,484
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER，LOOSE PIECE，TYPE
|
- | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.154" (3.90mm) | 0.094" (2.40mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
94,484
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER，LOOSE PIECE，TYPE
|
- | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.154" (3.90mm) | 0.094" (2.40mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER，LOOSE PIECE，TYPE
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER，LOOSE PIECE，TYPE
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.154" (3.90mm) | 0.079" (2.00mm) | Gold | 19.685μin (0.50μm) | Solder |
