- Operating Temperature：
-
- Type：
-
- Shape：
-
- Height：
-
- Width：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 484
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
35,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
11,004
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
11,004
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.3X1.0MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.3X1.0MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.3X1.0MM
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
MINI TECH CLIP
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
MINI TECH CLIP
|
- | - | - | - | - | - | - | - | - | ||
|
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
MINI TECH CLIP
|
- | - | - | - | - | - | - | - | - | ||
|
|
TE Connectivity AMP Connectors |
120,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
- | Shield Finger，Pre-Loaded | - | - | 0.041" (1.05mm) | 0.047" (1.20mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
128,582
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
- | Shield Finger，Pre-Loaded | - | - | 0.041" (1.05mm) | 0.047" (1.20mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
128,582
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHILEDFINGER1210EMBOSSPACKING
|
- | Shield Finger，Pre-Loaded | - | - | 0.041" (1.05mm) | 0.047" (1.20mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
46,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Tin | 100μin (2.54μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
47,689
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Tin | 100μin (2.54μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
47,689
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | Shield Finger | - | - | 0.157" (4.00mm) | 0.098" (2.50mm) | Tin | 100μin (2.54μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHILED FINGER 1210 EMBOSS PACKIN
|
- | - | - | - | - | - | - | - | - | |||
|
|
TE Connectivity AMP Connectors |
8,926
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
1.1H SPRING FINGER W/EMBOSS
|
- | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.043" (1.10mm) | 0.039" (1.00mm) | Gold | Flash | Solder |
