Odonata Lepidoptera products 9
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Material Shape Height Width Plating Plating - Thickness Attachment Method
67BCG2004005508R00
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMD CONTACT 2.0X4.0X5.5
- - - - 0.078" (2mm) - - -
67BCG2004005508R00
Laird Technologies EMI
1,044
III dies
-
MOQ: 1  MPQ: 1
SMD CONTACT 2.0X4.0X5.5
- - - - 0.078" (2mm) - - -
67BCG2004005508R00
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
SMD CONTACT 2.0X4.0X5.5
- - - - 0.078" (2mm) - - -
SMG236295R-0.157
Leader Tech Inc.
1,200
III dies
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.295" (7.49mm) - - -
SMG236295R-0.157
Leader Tech Inc.
2,400
III dies
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.295" (7.49mm) - - -
SMG236295R-0.157
Leader Tech Inc.
2,400
III dies
-
MOQ: 1  MPQ: 1
SURFACE MOUNT GASKET
Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.295" (7.49mm) - - -
1674954-1
TE Connectivity AMP Connectors
Quaestiones
-
-
MOQ: 1  MPQ: 1
ACCY SPRING SHIELD FINGER
Shield Finger - - 0.079" (2.00mm) 0.102" (2.60mm) - - Solder
2286211-3
TE Connectivity AMP Connectors
Quaestiones
-
-
MOQ: 1  MPQ: 1
HIGH CURRENT SPRING FINGER
Shield Finger,Pre-Loaded Copper Alloy - 0.094" (2.40mm) 0.067" (1.70mm) Gold 19.685μin (0.50μm) Solder
2286211-3
TE Connectivity AMP Connectors
33,281
III dies
-
MOQ: 1  MPQ: 1
HIGH CURRENT SPRING FINGER
Shield Finger,Pre-Loaded Copper Alloy - 0.094" (2.40mm) 0.067" (1.70mm) Gold 19.685μin (0.50μm) Solder