- Material：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 5
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
221
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | 12.000" (304.80mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | 12.000" (304.80mm) | - | - | - | ||
|
|
|
PulseLarsen Antennas |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA
|
Shield Clip | - | 0.096" (2.44mm) | 0.126" (3.20mm) | - | - | Clip | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
HIGH CURRENT SPRING FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | 0.094" (2.40mm) | 0.157" (4.00mm) | Gold | 19.685μin (0.50μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
33,281
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
HIGH CURRENT SPRING FINGER
|
Shield Finger，Pre-Loaded | Copper Alloy | 0.094" (2.40mm) | 0.157" (4.00mm) | Gold | 19.685μin (0.50μm) | Solder |
