- Series:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 6
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 0.250" (6.35mm) | 1.090" (27.69mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 0.080" (2.03mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 0.410" (10.41mm) | 1.630" (41.40mm) | Tin | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 0.410" (10.41mm) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 0.410" (10.41mm) | 1.630" (41.40mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
|
Large Enclosure | 0.250" (6.35mm) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware,Rivet,Solder |