- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
-
- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 332
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
20,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MAXI TIN SMD
|
EZ BoardWare | -25°C ~ 150°C | Shield Clip | Stainless Steel | - | 0.144" (3.65mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
70,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
72,963
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
72,963
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,050
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | 98.43μin (2.50μm) | Solder | ||
|
|
|
Harwin Inc. |
11,509
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Stainless Steel | - | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | 98.43μin (2.50μm) | Solder | ||
|
|
|
Harwin Inc. |
9,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 5.5MM HIGH TIN
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | 94.49μin (2.40μm) | Solder | ||
|
|
|
Harwin Inc. |
10,340
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 5.5MM HIGH TIN
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | 94.49μin (2.40μm) | Solder | ||
|
|
|
Harwin Inc. |
10,340
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 5.5MM HIGH TIN
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | 94.49μin (2.40μm) | Solder | ||
|
|
|
Harwin Inc. |
4,900
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
5,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Shield Finger | Beryllium Copper | - | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
20,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
22,663
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
22,663
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
3,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder |
