- Series:
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- Operating Temperature:
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- Material:
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- Shape:
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- Height:
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- Length:
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- Width:
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- Plating - Thickness:
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- Attachment Method:
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- Electus conditionibus;
Odonata Lepidoptera products 332
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | ||
Harwin Inc. |
4,381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
3,095
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI SHIELD CLIP 100% TIN
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
1,817
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
1,817
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.207" (5.25mm) | 0.042" (1.07mm) | 118.11μin (3.00μm) | Solder | ||||
Laird Technologies EMI |
33
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | 299.21μin (7.60μm) | Adhesive | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
- | -40°C ~ 85°C | Shield Clip | Stainless Steel | - | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||||
Laird Technologies EMI |
19
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.1X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/REEL CUNI
|
EZ BoardWare | -40°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.088" (2.23mm) | 0.200" (5.08mm) | 0.042" (1.07mm) | 118.11μin (3.00μm) | Solder | ||||
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI SHIELD CLIP 100/BAG
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | 118.11μin (3.00μm) | Solder | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X6.35MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.1X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 3.81X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.150" (3.81mm) | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Adhesive |