- Series：
-
- Operating Temperature：
-
- Height：
-
- Length：
-
- Width：
-
- Plating - Thickness：
-
- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 173
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
183,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.071" (1.80mm) | 0.098" (2.50mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.098" (2.50mm) | 0.138" (3.50mm) | 0.079" (2.00mm) | 51.18μin (1.30μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
19,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.051" (1.30mm) | 0.093" (2.37mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
30,219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.051" (1.30mm) | 0.093" (2.37mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
30,219
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.3MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.051" (1.30mm) | 0.093" (2.37mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
54,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
57,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder |
