- Series：
-
- Operating Temperature：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 173
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
57,760
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.118" (3.00mm) | 0.147" (3.73mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
36,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
40,874
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 3.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.138" (3.50mm) | 0.149" (3.79mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
498,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
19,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X4.27MM
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
TE Connectivity AMP Connectors |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER NICKEL 2.49MM
|
- | - | Shield Finger | Copper Alloy | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
9,272
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER NICKEL 2.49MM
|
- | - | Shield Finger | Copper Alloy | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | 1.967μin (0.05μm) | Solder | |||
|
|
|
Wurth Electronics Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 5
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.220" (5.59mm) | 0.118" (3.00mm) | - | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 5
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | Beryllium Copper | 0.157" (4.00mm) | 0.220" (5.59mm) | 0.118" (3.00mm) | - | Solder |
