- Series：
-
- Operating Temperature：
-
- Height：
-
- Length：
-
- Width：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 173
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Rivet | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | 299.21μin (7.60μm) | Rivet | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,RIVIT
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Rivet | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIE,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Rivet | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,NID,USFT,CLO
|
Clip-On | 121°C | Fingerstock | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIS,USFT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
VSLMT,STR,NIE
|
- | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,NID
|
- | 121°C | Fingerstock | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA,POR
|
- | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 0.17--11-S-32RH-N
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.170" (4.32mm) | 0.320" (8.13mm) | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.125 X 0.78 NI 16--11-78R2-NI-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.35 NI 0.358 NTP--11-35D
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.358" (9.09mm) | 0.350" (8.89mm) | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.067 X 0.177 NI 4.2--7-19PCI-NI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 4.200" (106.68mm) | 1.800" (45.72mm) | Flash | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET ULTRASOFT 8.1MMX7.6M
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL NIE PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | 299.21μin (7.60μm) | Hardware，Rivet，Solder |
