Odonata Lepidoptera products 10
Image part manufacturer quantitas partus tempus Unit Price buy Description Series Operating Temperature Type Material Height Length Plating Attachment Method
97043802
Laird Technologies EMI
97
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 27.69MMX406.4MM
- 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) - Hardware,Rivet,Solder
0C97043802
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Large Enclosure 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 25.000 (7.62m) - Hardware,Rivet,Solder
0C98043802
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
CSTR COIL BF USF
Large Enclosure 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 25.000 (7.60m) Unplated Adhesive
25-109FSDS-BD-24
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 BD 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 24.000" (609.60mm) Unplated Adhesive
0097043808N00953
Laird Technologies EMI
Quaestiones
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-
MOQ: 1  MPQ: 1
AP PCS SNSAT CTL
- - - - - - - -
25-109C-070-BD-16
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 X 070 BD 16--25-109C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) Unplated Adhesive
25-109C-120-BD-16
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 X 120 BD 16--25-109C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) Unplated Adhesive
25-109C-130-BD-16
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 X 130 BD 16--25-109C
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 16.000" (406.40mm) Unplated Adhesive
25-109FSDS-SU-300
Leader Tech Inc.
Quaestiones
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 SU 300"--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 25.00 (7.62m) Unplated Adhesive
25-109FSDS-BD-300
Leader Tech Inc.
Quaestiones
-
-
MOQ: 1  MPQ: 1
0.25 X 1.09 BD 300"--FOLDED SERI
- -55°C ~ 121°C Fingerstock Beryllium Copper 0.250" (6.35mm) 25.00 (7.62m) Unplated Adhesive