Plating:
Attachment Method:
Odonata Lepidoptera products 3
Image part manufacturer quantitas partus tempus Unit Price buy Description Type Material Height Plating Attachment Method
0D97065402
Laird Technologies EMI
1
III dies
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 1.6X304.8MM
Fingerstock Beryllium Copper 0.055" (1.40mm) Unplated Clip
97065417
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
DES,STR,SNB,CLO
- - - - -
97065415
Laird Technologies EMI
Quaestiones
-
-
MOQ: 1  MPQ: 1
DES,STR,ZNC,CLO
- - - - -