- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 336
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Attachment Method | |
|
|
|
Harwin Inc. |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
12,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
13,779
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
13,779
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.079" (2.00mm) | 0.181" (4.60mm) | 0.110" (2.80mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
8,394
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.3MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.118" (3.00mm) | 0.059" (1.50mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
2,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
3,537
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
3,537
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.75MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.108" (2.75mm) | 0.246" (6.25mm) | 0.125" (3.18mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
6,720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Solder |
