- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 336
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | 0.106" (2.70mm) | 0.150" (3.80mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
958
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
958
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
546
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Solder | ||
|
|
|
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Solder |
