- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 336
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Attachment Method | |
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 2.5H TI CU G/F P
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.098" (2.50mm) | 0.192" (4.87mm) | 0.050" (1.28mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 3.5H TI CU G/F P
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.055" (1.40mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT GOLD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.061" (1.55mm) | 0.137" (3.48mm) | 0.059" (1.50mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
1.80MM HEIGHT UNIVERSAL CONTACT
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.071" (1.80mm) | 0.134" (3.40mm) | 0.028" (0.70mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT GOLD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.083" (2.10mm) | 0.134" (3.40mm) | 0.043" (1.10mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3.50MM HEIGHT UNIVERSAL CONTACT
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT GOLD
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.161" (4.10mm) | 0.197" (5.00mm) | 0.055" (1.40mm) | Gold | Solder | ||
|
|
|
Amphenol FCI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRINT CONTACT GOLD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Solder | ||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 1715 ON TAPE (EM
|
- | - | Shield Finger | Titanium Copper | 0.118" (3.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
11,189
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 1715 ON TAPE (EM
|
- | - | Shield Finger | Titanium Copper | 0.118" (3.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3025-Z1-T
|
- | - | Shield Finger | Titanium Copper | 0.118" (3.00mm) | 0.175" (4.45mm) | 0.098" (2.50mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
24,810
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3025-Z1-T
|
- | - | Shield Finger | Titanium Copper | 0.118" (3.00mm) | 0.175" (4.45mm) | 0.098" (2.50mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
3.0H SPRING FINGER WITH EMBOSS
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | 0.118" (3.00mm) | 0.114" (2.90mm) | 0.047" (1.20mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 4025
|
- | - | Shield Finger | Copper Alloy | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER
|
- | - | Shield Finger | Copper Alloy | 0.276" (7.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Solder | |||
|
|
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHILED FINGER 1310 EMBOSS PACKIN
|
- | - | Shield Finger，Pre-Loaded | Copper Alloy | 0.051" (1.30mm) | 0.094" (2.40mm) | 0.045" (1.15mm) | Gold | Solder | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.356--11-32RH-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | Tin | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.917--11-S-32AF-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.917" (23.29mm) | 0.320" (8.13mm) | Tin | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 0.17--11-S-32RH-N
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.170" (4.32mm) | 0.320" (8.13mm) | Nickel | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.125 X 0.78 NI 16--11-78R2-NI-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Nickel | Adhesive |
