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- Electus conditionibus;
Odonata Lepidoptera products 209
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | |
|
|
|
ITT Cannon，LLC |
498,400
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Titanium Copper | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Titanium Copper | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
499,117
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Titanium Copper | 0.098" (2.50mm) | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
19,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Titanium Copper | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Titanium Copper | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
ITT Cannon，LLC |
20,553
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 4.0MM
|
- | - | Titanium Copper | 0.157" (4.00mm) | 0.157" (3.99mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | ||
|
|
|
Harwin Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
7,802
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.138" (3.50mm) | 0.159" (4.05mm) | 0.098" (2.50mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
7,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
10,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
10,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 4.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.177" (4.50mm) | 0.138" (3.50mm) | 0.098" (2.50mm) | Gold | Flash | ||
|
|
|
Wurth Electronics Inc. |
2,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | ||
|
|
|
Wurth Electronics Inc. |
3,067
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.157" (4.00mm) | 0.177" (4.50mm) | 0.118" (3.00mm) | Gold | Flash | ||
|
|
|
Molex Connector Corporation |
9,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Stainless Steel | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | ||
|
|
|
Molex Connector Corporation |
9,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Stainless Steel | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | ||
|
|
|
Molex Connector Corporation |
9,283
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 1.0UM GLD
|
- | - | Stainless Steel | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | ||
|
|
|
Harwin Inc. |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Flash | ||
|
|
|
Harwin Inc. |
37,436
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Copper Alloy | 0.050" (1.28mm) | 0.098" (2.50mm) | 0.039" (1.00mm) | Gold | Flash |
