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- Operating Temperature：
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- Height：
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- Length：
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- Plating：
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- Electus conditionibus;
Odonata Lepidoptera products 891
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
55
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X609.6MM
|
No Snag | 121°C | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
60
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.79X609.6MM
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
79
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
71
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7X406.6MM
|
- | 121°C | Beryllium Copper | 0.080" (2.04mm) | 16.000" (406.40mm) | 0.275" (6.99mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
43
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.176X406.4MM
|
- | 121°C | Beryllium Copper | 0.170" (4.32mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
39
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.57X431.8MM
|
- | 121°C | Beryllium Copper | 0.176" (4.47mm) | 17.056" (433.22mm) | 0.295" (7.49mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
100
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.4X406.4MM
|
- | 121°C | Beryllium Copper | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
33
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4X609.6MM
|
Twist | 121°C | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
35
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 13X406.4MM
|
Foldover | 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
74
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
- | 121°C | Beryllium Copper | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | - | - | Rivet | ||
|
|
|
Laird Technologies EMI |
63
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
71
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
97
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
- | 121°C | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
22
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTOCK BECU ALY 7.57X609.6MM
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 8.1X406.4MM
|
Slot Mount | 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
19
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.1X406.4MM
|
- | 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X20.57MM
|
Slot Mount | 121°C | Beryllium Copper | 0.220" (5.59mm) | 0.810" (20.57mm) | 0.600" (15.24mm) | - | - | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X4.27MM
|
Slot Mount | 121°C | Beryllium Copper | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | Nickel | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X12.07MM
|
Slot Mount | 121°C | Beryllium Copper | 0.130" (3.30mm) | 0.475" (12.07mm) | 0.370" (9.40mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Slot |
