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- Electus conditionibus;
Odonata Lepidoptera products 891
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.62 BD 15--22-62DT-BD-15
|
- | -55°C ~ 121°C | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.62 BD 15--22-62DTS-BD-1
|
- | -55°C ~ 121°C | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.30 SN 24--6-30T-SN-24--
|
- | -55°C ~ 121°C | Beryllium Copper | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 BD 16--11-S-32AH-BD-
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
PCLIP,STR,SNB,USF,CLO
|
- | 121°C | Beryllium Copper | 0.305" (7.75mm) | 11.945" (303.40mm) | - | Tin | 299.21μin (7.60μm) | Clip | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.125 X 0.78 BD 16--11-78R2-BD-1
|
- | -55°C ~ 121°C | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.24 SN 16.0--FOLD
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.30 NI 24--6-30T-NI-24--
|
- | -55°C ~ 121°C | Beryllium Copper | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.14 SN 24--TWIST RIGHT A
|
- | -55°C ~ 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.140" (3.56mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Beryllium Copper | 0.060" (1.52mm) | 16.000" (406.40mm) | 0.220" (5.59mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.90 BD 16--11-90S-BD-16-
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.900" (22.86mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 85.875 NTP--FOLDE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.250" (6.35mm) | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 0.045 BD 16--10-30
|
TechMESH | -55°C ~ 121°C | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 050 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 065 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 070 BD 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 16--11-32AH-SN-16
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive |
