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- Electus conditionibus;
Odonata Lepidoptera products 891
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.375 NI 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.375 SN 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16--22-60AH-BD-16
|
- | -55°C ~ 121°C | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 BD 16 NTP--22-60AH-B
|
- | -55°C ~ 121°C | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 NI 16--22-60RH-NI-16
|
- | -55°C ~ 121°C | Beryllium Copper | 0.220" (5.59mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.06 X 0.50 SN 24--TWIST DOUBLE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.060" (1.52mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.78 NI 16--9-78D-A-NI-16
|
- | -55°C ~ 121°C | Beryllium Copper | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.780" (19.81mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.92 BD 16--8-92RC-BD-16-
|
- | -55°C ~ 121°C | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.920" (23.37mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.28 NI 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 SN 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.22 X 0.60 SN 15--22-62DT-SN-15
|
- | -55°C ~ 121°C | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 BD 12--FOLDED SERIES
|
- | -55°C ~ 121°C | Beryllium Copper | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.067 X 0.177 NI 9.0--7-19PCI-NI
|
- | -55°C ~ 121°C | Beryllium Copper | 0.070" (1.78mm) | 9.000" (228.60mm) | 1.800" (45.72mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 NI 16--11-32AH-NI-16
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.510 NI 16--FOLDED SERIE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Nickel | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.51 SN 16.0--FOLDED SERI
|
- | -55°C ~ 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | Flash | Adhesive | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | Beryllium Copper | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.35 SN 15 NTP--11-35DT-S
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 SN 16.0--13-37AH-SN-
|
- | -55°C ~ 121°C | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.60 BD 16--12-60LPAH-BD-
|
- | -55°C ~ 121°C | Beryllium Copper | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.600" (15.24mm) | Unplated | - | Adhesive |