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- Electus conditionibus;
Odonata Lepidoptera products 891
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.26 AU 16--10-26UD-AU-16
|
TechMESH | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Gold | Flash | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 AU 16--11-S-32AH-AU-
|
- | -55°C ~ 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | Gold | Flash | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Beryllium Copper | 0.140" (3.56mm) | 25.00 (7.62m) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.08 SN 300--TWIST RIGHT
|
- | -55°C ~ 121°C | Beryllium Copper | 0.030" (0.76mm) | 25.00 (7.62m) | 0.080" (2.03mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.34 BD 300--6-34T-BD-300
|
- | -55°C ~ 121°C | Beryllium Copper | 0.070" (1.78mm) | 25.00 (7.62m) | 0.340" (8.64mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 400--FOLDED SERIE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.230" (5.84mm) | 33.33 (10.16m) | 0.600" (15.24mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Beryllium Copper | 0.250" (6.35mm) | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.25 BD 400--FOLDED SERIE
|
- | -55°C ~ 121°C | Beryllium Copper | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL CDY PSA
|
All-Purpose | 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Cadmium + Yellow Chromate | 299.21μin (7.60μm) | Adhesive |
