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- Electus conditionibus;
Odonata Lepidoptera products 891
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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|
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Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X457.2MM
|
No Snag | 121°C | Beryllium Copper | 0.220" (5.59mm) | 18.000" (457.20mm) | 0.600" (15.24mm) | - | - | Slot | ||
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|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | 121°C | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | - | - | Rivet | ||
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|
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Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 25X406.4MM
|
- | 121°C | Beryllium Copper | 0.400" (10.16mm) | 24.000" (609.60mm) | 0.980" (24.89mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
7
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.6X609.6MM
|
- | 121°C | Beryllium Copper | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | - | - | Snap-In | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | 121°C | Beryllium Copper | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | ||
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|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
- | 121°C | Beryllium Copper | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | Beryllium Copper | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.7X609.6MM
|
Twist | 121°C | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
Leader Tech Inc. |
453
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Beryllium Copper | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.320" (8.13mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
243
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | - | |||
|
|
Leader Tech Inc. |
476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | - | Adhesive | |||
|
|
Leader Tech Inc. |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | - | Adhesive | |||
|
|
Laird Technologies EMI |
53
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
.140X.370 GASKET FABRIC O/ FOAM
|
- | 121°C | Beryllium Copper | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
93
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Beryllium Copper | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - |
