- Series：
-
- Operating Temperature：
-
- Height：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 17
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
19,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MAXI TIN SMD
|
EZ BoardWare | -25°C ~ 150°C | Stainless Steel | 0.144" (3.65mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
20,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MAXI TIN SMD
|
EZ BoardWare | -25°C ~ 150°C | Stainless Steel | 0.144" (3.65mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
20,632
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MAXI TIN SMD
|
EZ BoardWare | -25°C ~ 150°C | Stainless Steel | 0.144" (3.65mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
70,300
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
72,963
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
72,963
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
3,800
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
4,381
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
3,095
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI SHIELD CLIP 100% TIN
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | Gold | - | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI SHIELD CLIP 100/BAG
|
EZ BoardWare | -40°C ~ 125°C | Stainless Steel | 0.140" (3.55mm) | 0.346" (8.79mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
Leader Tech Inc. |
22,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Phosphor Bronze | 0.137" (3.48mm) | 0.310" (7.87mm) | Tin | - | - | |||
|
|
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Phosphor Bronze | 0.137" (3.48mm) | 0.310" (7.87mm) | Tin | - | - | |||
|
|
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Phosphor Bronze | 0.137" (3.48mm) | 0.310" (7.87mm) | Tin | - | - |
