- Operating Temperature：
-
- Height：
-
- Length：
-
- Width：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Electus conditionibus;
Odonata Lepidoptera products 31
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
165,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
171,519
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
171,519
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.054" (1.37mm) | 0.256" (6.50mm) | 0.035" (0.90mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
260,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
274,269
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
274,269
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MICRO TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.035" (0.90mm) | 0.177" (4.50mm) | 0.024" (0.60mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
145,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
154,577
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
154,577
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.083" (2.10mm) | 0.233" (5.92mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
78,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.055" (1.40mm) | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
81,078
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.055" (1.40mm) | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
81,078
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP R/A TIN SMD
|
-25°C ~ 150°C | Stainless Steel | 0.055" (1.40mm) | 0.185" (4.70mm) | 0.031" (0.80mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
20,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
22,663
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
22,663
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.050" (1.28mm) | 0.256" (6.50mm) | 0.039" (1.00mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,627
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
|
-40°C ~ 85°C | Stainless Steel | 0.039" (1.00mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder |
