- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 146
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
167,200
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/TR (T&R)
|
EZ BoardWare | -40°C ~ 125°C | Copper Alloy | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
172,856
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/TR (T&R)
|
EZ BoardWare | -40°C ~ 125°C | Copper Alloy | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
172,856
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMT RFI CLIP 1900/TR (T&R)
|
EZ BoardWare | -40°C ~ 125°C | Copper Alloy | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
90,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
90,634
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
90,634
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.067" (1.70mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
14,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Stainless Steel | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Stainless Steel | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Stainless Steel | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
17,594
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
17,594
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 5.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Copper Alloy | 0.219" (5.57mm) | 0.274" (6.95mm) | 0.114" (2.90mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
36,050
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Beryllium Copper | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Beryllium Copper | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
36,232
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN SMD
|
EZ BoardWare | - | Beryllium Copper | 0.285" (7.25mm) | 0.378" (9.59mm) | 0.224" (5.70mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
7,500
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Phosphor Bronze | 0.098" (2.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Phosphor Bronze | 0.098" (2.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Phosphor Bronze | 0.098" (2.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Phosphor Bronze | 0.138" (3.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
4,411
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Phosphor Bronze | 0.138" (3.50mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder |
