- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 146
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
6,720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
6,720
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.059" (1.50mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.118" (3.00mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.118" (3.00mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.118" (3.00mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.098" (2.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.098" (2.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.098" (2.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.079" (2.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,275
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.079" (2.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,275
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.079" (2.00mm) | 0.106" (2.70mm) | 0.059" (1.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,944
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.138" (3.50mm) | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Beryllium Copper | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,511
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - |
