- Series：
-
- Operating Temperature：
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- Height：
-
- Length：
-
- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 101
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
72,963
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP TIN SMD
|
EZ BoardWare | -40°C ~ 125°C | Shield Clip | 0.140" (3.55mm) | 0.346" (8.79mm) | 0.090" (2.28mm) | Tin | 118.11μin (3.00μm) | Solder | ||
|
|
|
Harwin Inc. |
14,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
15,449
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 4MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | 0.157" (4.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Molex，LLC |
64,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
72,070
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.70MM - 1.10MM H
|
- | - | Shield Finger，Pre-Loaded | 0.055" (1.40mm) | 0.154" (3.90mm) | 0.087" (2.20mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
45,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.42MM
|
- | - | Shield Finger，Pre-Loaded | 0.059" (1.50mm) | 0.090" (2.28mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,188
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.42MM
|
- | - | Shield Finger，Pre-Loaded | 0.059" (1.50mm) | 0.090" (2.28mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,188
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.42MM
|
- | - | Shield Finger，Pre-Loaded | 0.059" (1.50mm) | 0.090" (2.28mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
27,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 0.25UM GLD
|
- | - | Shield Finger，Pre-Loaded | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | Solder | ||
|
|
|
Molex，LLC |
30,855
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 0.25UM GLD
|
- | - | Shield Finger，Pre-Loaded | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | Solder | ||
|
|
|
Molex，LLC |
30,855
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
ANTI SNAG SPRING CONT 0.25UM GLD
|
- | - | Shield Finger，Pre-Loaded | 0.043" (1.10mm) | 0.138" (3.50mm) | 0.039" (1.00mm) | Gold | 39.370μin (1.00μm) | Solder | ||
|
|
|
Molex，LLC |
42,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | 0.077" (1.95mm) | 0.098" (2.50mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,725
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | 0.077" (1.95mm) | 0.098" (2.50mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,725
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | 0.077" (1.95mm) | 0.098" (2.50mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
24,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 2.20MM
|
- | - | Shield Finger，Pre-Loaded | 0.087" (2.20mm) | 0.094" (2.40mm) | 0.052" (1.32mm) | Gold | 9.843μin (0.25μm) | Solder | ||
|
|
|
Molex，LLC |
32,728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 2.20MM
|
- | - | Shield Finger，Pre-Loaded | 0.087" (2.20mm) | 0.094" (2.40mm) | 0.052" (1.32mm) | Gold | 9.843μin (0.25μm) | Solder | ||
|
|
|
Molex，LLC |
32,728
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 2.20MM
|
- | - | Shield Finger，Pre-Loaded | 0.087" (2.20mm) | 0.094" (2.40mm) | 0.052" (1.32mm) | Gold | 9.843μin (0.25μm) | Solder | ||
|
|
|
Harwin Inc. |
10,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
EMI SHIELD FINGER T&R(2000/R)
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | 0.138" (3.50mm) | 0.177" (4.50mm) | 0.098" (2.50mm) | Tin | 98.43μin (2.50μm) | Solder |
