- Series:
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- Type:
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- Height:
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- Length:
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- Width:
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- Plating - Thickness:
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- Attachment Method:
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- Electus conditionibus;
Odonata Lepidoptera products 508
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
35,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
37,980
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 2.9X1.5MM
|
- | - | - | - | - | - | - | - | ||||
Harwin Inc. |
1,750
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||||
Harwin Inc. |
2,087
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER GOLD SMD
|
- | Shield Finger | 0.285" (7.25mm) | 0.378" (9.60mm) | 0.225" (5.70mm) | Gold | Flash | Solder | ||||
Laird Technologies EMI |
2,397
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.88X11.35MM
|
- | - | - | 0.447" (11.35mm) | 0.625" (15.88mm) | - | - | - | ||||
Laird Technologies EMI |
157
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 3.18X304.8MM
|
- | - | - | 12.000" (304.80mm) | 0.125" (3.18mm) | - | - | - | ||||
Laird Technologies EMI |
218
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 4.6X406.4MM
|
- | - | - | 16.000" (406.40mm) | 0.181" (4.60mm) | - | - | - | ||||
Laird Technologies EMI |
156
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | 12.000" (304.80mm) | 0.063" (1.60mm) | - | - | - | ||||
Laird Technologies EMI |
328
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.11X406.4MM
|
- | - | - | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | - | ||||
Laird Technologies EMI |
221
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | 12.000" (304.80mm) | 0.067" (1.70mm) | - | - | - | ||||
Laird Technologies EMI |
483
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 6.35X406.4MM
|
- | - | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||||
Laird Technologies EMI |
6,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
11,004
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
11,004
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 3.1X2.5MM
|
- | - | - | - | - | - | - | - | ||||
Laird Technologies EMI |
1,437
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
CARD GUI CLIPON BECU 3.05X9.53MM
|
- | - | - | 0.375" (9.53mm) | 0.120" (3.05mm) | - | - | - | ||||
Laird Technologies EMI |
1,428
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | 12.000" (304.80mm) | 0.063" (1.60mm) | - | - | - | ||||
Laird Technologies EMI |
333
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | 12.000" (304.80mm) | 0.067" (1.70mm) | - | - | - | ||||
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD CONTACT 2.0X4.0X5.5
|
- | - | - | 0.157" (4.00mm) | 0.078" (2mm) | - | - | - |