- Series：
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- Operating Temperature：
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- Height：
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- Length：
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- Width：
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- Plating - Thickness：
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- Attachment Method：
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- Electus conditionibus;
Odonata Lepidoptera products 147
 |
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
95,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
112,249
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.3MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.051" (1.30mm) | 0.137" (3.48mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
238,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
242,742
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 1.8MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.071" (1.80mm) | 0.132" (3.35mm) | 0.035" (0.90mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
75,600
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.138" (3.50mm) | 0.197" (5.00mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 4MM SMD
|
- | - | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.194" (4.92mm) | 0.043" (1.10mm) | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 8.1X4.27MM
|
Slot Mount | 121°C | Fingerstock | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 121°C | Fingerstock | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
- | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 5
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.220" (5.59mm) | 0.118" (3.00mm) | - | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 5
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.220" (5.59mm) | 0.118" (3.00mm) | - | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 5
|
WE-SECF | -40°C ~ 100°C | Shield Finger，Pre-Loaded | 0.157" (4.00mm) | 0.220" (5.59mm) | 0.118" (3.00mm) | - | Solder | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,1F,NID
|
Slot Mount | 121°C | Fingerstock | 0.220" (5.59mm) | 0.250" (6.35mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Slot | ||
|
|
|
Laird Technologies EMI |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SLMT,2F,NIE
|
Slot Mount | 121°C | Fingerstock | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.320" (8.13mm) | 299.21μin (7.60μm) | Slot |
