- Series:
-
- Operating Temperature:
-
- Height:
-
- Length:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Electus conditionibus;
Odonata Lepidoptera products 31
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Harwin Inc. |
56
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 3MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||||
TE Connectivity AMP Connectors |
30,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
2.3H SHLD FINGER LOOSE TYP B SMT
|
- | - | Shield Finger,Pre-Loaded | 0.091" (2.30mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
TE Connectivity AMP Connectors |
32,459
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
2.3H SHLD FINGER LOOSE TYP B SMT
|
- | - | Shield Finger,Pre-Loaded | 0.091" (2.30mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
Leader Tech Inc. |
22,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Shield Clip | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | Tin | - | - | ||||
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Shield Clip | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | Tin | - | - | ||||
Leader Tech Inc. |
23,160
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SMS,TECH CLIP--PCB--SHIELD COVER
|
- | - | Shield Clip | 0.137" (3.48mm) | 0.310" (7.87mm) | 0.090" (2.28mm) | Tin | - | - | ||||
Wurth Electronics Inc. |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 3
|
WE-SECF | -40°C ~ 100°C | Shield Finger,Pre-Loaded | 0.209" (5.30mm) | 0.142" (3.60mm) | 0.110" (2.80mm) | Nickel | - | Solder | ||||
Wurth Electronics Inc. |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 3
|
WE-SECF | -40°C ~ 100°C | Shield Finger,Pre-Loaded | 0.209" (5.30mm) | 0.142" (3.60mm) | 0.110" (2.80mm) | Nickel | - | Solder | ||||
Wurth Electronics Inc. |
4,000
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER 3
|
WE-SECF | -40°C ~ 100°C | Shield Finger,Pre-Loaded | 0.209" (5.30mm) | 0.142" (3.60mm) | 0.110" (2.80mm) | Nickel | - | Solder | ||||
TE Connectivity AMP Connectors |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER,LOOSE PIECE,TYPE
|
- | - | Shield Finger,Pre-Loaded | 0.079" (2.00mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | 19.685μin (0.50μm) | Solder | ||||
TE Connectivity AMP Connectors |
534
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER,LOOSE PIECE,TYPE
|
- | - | Shield Finger,Pre-Loaded | 0.079" (2.00mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | Gold | 19.685μin (0.50μm) | Solder |