- Package / Case:
-
- Mounting Type:
-
- Output Type:
-
- Sensitivity:
-
- Electus conditionibus;
Odonata Lepidoptera products 25
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Package / Case | Mounting Type | Features | Termination | Output Type | Sensitivity | Sensor Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | part | manufacturer | quantitas | partus tempus | Unit Price | buy | Description | Series | Package / Case | Mounting Type | Features | Termination | Output Type | Sensitivity | Sensor Type | ||
TE Connectivity Measurement Specialties |
48
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM/SILVER INK
|
- | - | User Defined | - | - | - | - | - | ||||
TE Connectivity Measurement Specialties |
615
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
LDTC | Piezo Film,Cantilever (Wafer) | User Defined | - | PC Pins | Voltage | - | Vibration,Acceleration | ||||
TE Connectivity Measurement Specialties |
901
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
LDTC | Cantilever Piezo Film (Wafer) | Through Hole | - | PC Pins | Voltage | - | Vibration,Acceleration | ||||
Knowles |
99
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
MIC ACCELEROMETER VIBRATE SENSE
|
BU | Box | Surface Mount | - | Solder Pads | Voltage | -45dB ±4.5dB | Vibration,Acceleration | ||||
Comus International |
617
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION SPST .02A 24VAC
|
- | Nonstandard | Through Hole | - | - | - | - | - | ||||
TE Connectivity Measurement Specialties |
90
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
SENSOR VIBRATION
|
- | Module | User Defined | - | Wire Leads | - | - | - | ||||
TE Connectivity Measurement Specialties |
78
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM ELEMENT FLEX LEADS
|
FDT | Piezo Film,Cantilever (Wafer) | User Defined | - | Connector | Voltage | - | Vibration,Acceleration | ||||
TE Connectivity Measurement Specialties |
5
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM SHEET
|
- | - | User Defined | - | - | Voltage | - | Vibration | ||||
TE Connectivity Measurement Specialties |
11
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM SHEET
|
- | - | User Defined | - | - | - | - | - | ||||
TE Connectivity Measurement Specialties |
8
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
28 UM PIEZO FILM SHEET
|
- | - | User Defined | - | - | Voltage | - | Vibration | ||||
TE Connectivity Measurement Specialties |
4
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM SHEET
|
- | - | User Defined | - | - | Voltage | - | Vibration | ||||
TE Connectivity Measurement Specialties |
9
|
III dies |
-
|
MOQ: 1 MPQ: 1
|
PIEZO FILM SHEET 8X11 SILVER INK
|
- | - | User Defined | - | - | Voltage | - | Vibration | ||||
Knowles |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ACCELEROMETER
|
BU | Ceramic | User Defined | Waterproof | Solder Posts | Voltage | -40dB ±3dB | Vibration,Acceleration | ||||
Knowles |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ACCELEROMETER 1.5V LOW FREQ RESP
|
BU | Box | Surface Mount | - | Solder Pads | Voltage | -45dB ±4.5dB | Vibration,Acceleration | ||||
Knowles |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ACCELEROMETER 1.5VDC SOLDER
|
BU | Box | Surface Mount | - | Solder Pads | Voltage | -40dB ±3dB | Vibration,Acceleration | ||||
Knowles |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
ACCELEROMETER
|
BU | Ceramic | User Defined | Waterproof | Solder Posts | Voltage | -45dB ±4.5dB | Vibration,Acceleration | ||||
Mide Technology Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
PIEZO ENERGY HARVESTER 7NF
|
PPA | Cantilever Magneto Film (Wafer) | Chassis Mount | Piezoelectric Vibration Energy Harvesting,Hermetically Sealed | Solder Pads | Voltage | - | Vibration,Piezo Film | ||||
Mide Technology Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
PIEZO ENERGY HARVESTER 22NF
|
PPA | Cantilever Magneto Film (Wafer) | Chassis Mount | Piezoelectric Vibration Energy Harvesting,Hermetically Sealed | Solder Pads | Voltage | - | Vibration,Piezo Film | ||||
Mide Technology Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
PIEZO ENERGY HARVESTER 40NF
|
PPA | Cantilever Magneto Film (Wafer) | Chassis Mount | Piezoelectric Vibration Energy Harvesting,Hermetically Sealed | Solder Pads | Voltage | - | Vibration,Piezo Film | ||||
Mide Technology Corporation |
Quaestiones
|
- |
-
|
MOQ: 1 MPQ: 1
|
PIEZO ENERGY HARVESTER 120NF
|
PPA | Cantilever Magneto Film (Wafer) | Chassis Mount | Piezoelectric Vibration Energy Harvesting,Hermetically Sealed | Solder Pads | Voltage | - | Vibration,Piezo Film |